Item
problem
name
Phenomenon
Possible Causes
Countermeasures
1
Ink uneven
The surface ink cannot be evenly attached to the dot-like strips or the white dots in the sheet-like ink (cannot be inked)
Insufficient ink mixing time Ink mixing error Plate surface oil or water stain residue (pre-processed unclean)
Ink contamination (adhesion of adhesive tape to damage surface tension)
Scratched film material is bad Screen cleaning is not clean
Inspect the pre-treatment line to confirm the quality of the dry-drying section. Check that the pre-treatment section meets the process standards (water breaks, wear marks)
Confirm Ink Mixing Parameters Clean Screens, Replace Squeegees, Use Tools
2
Large copper surface cavity
1. Ink and copper surface separation in the full ink coverage area on the large copper surface
Poor pre-treatment Impurity on board surface Depression on the surface of the copper Poor ink mixing Inhomogeneous ink thickness on the copper surface Damaged ink surface Damaged uneven temperature distribution of the oven and insufficient baking or overbaking
Check the pre-treatment line to confirm whether each job segment can meet the quality requirements. Confirm the baking temperature and oven distribution heating curve Confirm the ink mixing parameters Check the production process to reduce the impact of external force Confirm the spraying operation parameters and status
2. Ink and copper surface separation in the full coverage area of ​​large copper or circuit surface corner ink
Ink printing is too thin. Pre-treatment at the corner of the line. Insufficient baking. Multiple sprays of tin or tin. Excessively long solder soak. Excessive flux attack. Damaged ink at corners.
Adjust solder mask printing thickness Reduce circuit plating thickness Confirm baking conditions and oven distribution heating curve Confirm spraying operation parameters and conditions Check production process to reduce external impact Check the pre-treatment line to confirm the quality requirements of the drying drying section
3
Plug hole
1. Ink spill after exposure
1. Exposure film is out of action
2. Defective exposure vacuum
3. The positioning plate is not inserted into the hole
4. Suction vacuum pressure is not stable
5. Miscellaneous matter attached to the film
1. The film needs to be tightly attached to the job board during exposure
2. Use air foil thinner than work board
3. Positioning PIN must be inserted into the positioning hole
4. Inspection film and self inspection
Item
Question name
Phenomenon
Possible Causes
Countermeasures
2. Post-baking ink overflow
1. Non-segmental warming
2. Sectional warming temperature in the low temperature section is too high
3. Section heating up low temperature period time insufficient
4. Sectional heating without continuous baking
5. Oven temperature distribution is uneven or direction is not fixed
1. Post-baking box must warm up for section
2. Section heating needs continuous baking
3. Confirm the heating curve in each area of ​​the oven
4. Hot air direction must be in the same direction
5. Confirm job parameters
3. Ink spill after spraying
Sectional warming temperature is too low
Insufficient time for segmental warming
Oven temperature distribution is uneven or direction is not fixed
Poor oven exhaust
Spray plate before pre-baking heating
Multiple spray tin
Bad film design
Confirm the heating curve in each area of ​​the oven
Confirm the post-baking operation parameters
Confirm tin spray operation parameters and conditions
Pre-baking heating plate before spraying
4
Sekong Vacuo
4. Tin foam after spraying tin
Spray plate before pre-baking heating
Multiple spray tin
Tin temperature is too high
Insufficient post baking
Poor pre-treatment (oil pore water residue)
Insufficient roughness in hole (insufficient etching rate)
Insufficient board surface roughness (poor brush etch rate)
Plug full
Section heating up low temperature period time insufficient
Ink swelling coefficient is too large
1. Pre-baking heating plate before spraying
2. Confirm tin spray operation parameters and conditions
3. Confirm the post-baking operation parameters
4. Check the pre-processing line to confirm whether it is in line with the standard quality of the process
5. Do not use the same ink for three jobs (plug, print, print)
6. Modify ink properties
7. Modify the design for crab feet
5
Broken line
Solder joint isolation line breaks between pads
1. Ink printing is too thick
2. Insufficient exposure energy
3. Development temperature is too high
4. Too much developing pressure
5. Development time is too long
6. Negative film transmittance is too low
7. Insufficient time to stay
8. Exposure lamp expired
9. Exposure cooling quartz tube is dirty
10. Insufficient ink sensitivity
11. Insufficient pre-baking
1. Confirm exposure job parameters
2. Confirm development job parameters
3. Reduce ink printing thickness
4. Increase dead time after exposure
5. Use better light transmittance worksheet
6. Confirm exposure lamp life
7. Modify ink properties
Item
Question name
Phenomenon
Possible Causes
Countermeasures
6
Unclean development
The ink cannot be completely removed in the area to be developed (black or brown area of ​​the film during solder resist exposure)
Pre-bake
Oven ventilation loop bad
Ink out of date or ink mixing error
Premature lag time is too long
Poor environment (humidity too high, temperature too high)
Work area non-UV light tube
Exposure energy is too high
Development temperature is too low
9. The developing pressure is too small
10. Insufficient developer concentration
11. Development time is too short
12. Film shading rate is too low
13. Diluent with high water
14. The plate itself transmits light
1. Verify ink brand compliance and ink quality before mixing
2. Confirm baking conditions and oven distribution heating curve
3. Confirm surrounding operating environment and equipment
4. Confirm exposure job parameters
5. Sure
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