According to the PCB size of 10 × 15cm, including 38 pieces of 0805 and 1206 and a single chip IC, the patch scheme is set based on 20 plug-in components for the THT process. The following plan is preliminarily set with Nissan 5K as the production quantity. The electronic production plant completes the production and assembly of a full set of electronic products. It is generally composed of the SMT process and the traditional THT plug-in process. It is recommended to use the SMT process in combination with the traditional THT process for the current stage of production. . (Mainly surface mount technology)
1. Production process recommendations
1. Suggested component assembly methods:
1) Single-sided solder soldering:
Note: Single-sided welding and double-sided welding are basically the same in the production process. Therefore, the selection of the process and the configuration of the equipment are basically the same in terms of personnel ranking. In actual production operations, the A side is welded first, and then repeated In the same process, make relative adjustments in the tin-printing process and the setting of the reflow soldering machine to solder the B side.
Second, the device configuration
A. India tin part:
1) .1 manual printing machine
2). 1 scraper (slurry mixing knife)
3). Steel mesh (customized according to your company's products)
4). Tin paste (patch glue)
Note: When double-sided soldering, the positioning plate needs to be added to the printing machine, and solder with the same melting point can be used for solder.
B. Patch part:
1). Manual patch pen 10 sets of manual patch, the general speed is 1 per person / 2-3 seconds, the mainland can be designed to place a component within 3 seconds.
2) .20 racks
3). One platform production line may be welded on both sides, so there must be a guide rail.
Note: the placement part can choose one automatic placement machine (0.20 seconds / piece)
C. Welding part:
1) .EW series hot air reflow soldering machine 1 (EW-MF540D)
Fourth, the process starts ---> A side printing tin paste ---> A side placement SMD components ---> component position correction QC ---> reflow soldering machine welding ---> appearance inspection repair welding QC ---> B-side in-line components ---> B-side welding THT components ---> appearance inspection repair welding QC ---> ultrasonic cleaning-
-> Functional test ---> End
V. Staffing: a total of 24 people / pull production requirements: output 5K / day number of components: 38 × 5000 = 190,000 pieces / day
A. Printing part:
Configuration 1 person: tin paste printing, use and stencil positioning, cleaning and protection.
B. Patch part:
SMT configuration 20 people: place SMT components and IC.
Speed: (60 seconds / 3 seconds) × 60 minutes × 8 hours × 20 people = 192000 pcs / day Note: One placement machine can be used Speed: (1 / 0.2) × 60 seconds × 60 minutes × 8 hours = 14400 Only / day can work overtime for another 3 hours to complete 54,000 QC configuration before welding 1 person: check components and correct placement of incorrect components and add tin paste
C. Welding part:
After welding, the QC configuration is 1 to 2 people: Welding point detection is completed for welding.
D. One team leader: Coordinate management and machine operation and maintenance of the entire production line.
6. Technical parameters
1A.1. Manual printing machine:
The manual printing machine misses the solder paste (patch glue) on the PCB pad (in the middle of the pad) and prepares for the next process. The manual printing machine is to manually carry out the work of placing, positioning, printing, taking the board and cleaning the screen. Its main parameters are as follows (model: medium)
Dimensions: 430mm × 610mm × 300mm
Printing area: 320mm × 440mm
Positioning method: side positioning or hole positioning adjustment method: manual fine adjustment adjustment direction: front and back, left and right, up and down.
1A.2. The scraper cooperates with the printing machine to print tin paste or patch glue, and the tin paste or patch glue leaks to the PCB through the steel mesh. Scrapers are generally divided into rubber scrapers and steel scrapers.
1A.3, SMT steel mesh In order to ensure the implementation of SMT this high-efficiency process, steel mesh must be used as an auxiliary material.
Screen printing is the first step in the SMT process. The high accuracy of the mold, uniform coating and high efficiency are of great significance in the entire automated process. Screen printing is screen printing (SCREEN PRINTING) and screen printing (SILK METHOD). The actual application is mainly based on screen leakage. Screen leakage is to engrave a leak solder paste or glue through the metal template to the pad on the PCB board.
The leak holes in the SMT process are now chemically etched or photolithographically thick-film processes. Lithography is mainly aimed at large-scale integrated circuits with fine pitch, such as 340-pin TQFP, etc., but the process cost is relatively high, and the chemical etching process is widely used. For general chip components and pitch is 0.5mm The above QFP can achieve a perfect effect, and for products with a pitch less than 0.5mm, it is generally made by the laser (LASER) method. Due to the use of templates, the metal plate generally uses stainless steel. The company generally provides customers with LASER process and chemical corrosion. Process stainless steel mesh:
Specifications: Frame material: aluminum alloy.
Frame size: 13 × 16 14 × 20 22 × 26 23 × 23 inches, etc.
Frame width: 30mm
Wire mesh material: Tetoron mesh (36T)
Metal plate surface: stainless steel Minimum pitch: 0.254mm
. Customized requirements (customers provide information): 1. Solder joint film 2. Light drawing file 3. PCB light board (any multi-layer)
Generally only need to provide any one of the above three materials, special requirements (outer frame size, process LASER) must be put forward first.
Attached
1B1. Manual placement machine Manual placement machine is an important tool for manual surface mounting technology. It mainly simulates the placement nozzle of the placement machine manually. The air pressure difference (reverse vacuum) generated by the manual placement machine itself , Directly pick up the chip components from the tape, and then manually place the components on the corresponding PADS position. With the adjusted air pressure suction, the suction power of the manual placement machine is less than the adhesion of tin paste Force, components are automatically placed on the corresponding PADS.
In addition, the size of the suction force can be adjusted through the adjustment switch to adapt to components of different sizes and weights.
The manual placement machine is more stable and more efficient than traditional tweezers. The manual placement machine directly picks up the material from the tape to avoid wasting components. At the same time, there is no problem of the front and back sides of the components and the directionality, which makes the placement efficiency higher. At the same time, the manual placement machine directly sucks the back of the components to avoid tweezers. The edge position of the device destroys the pad position to avoid the phenomenon of solder balls, continuous soldering and solder bridges. In addition, use a suction pen to suck the back of the IC, etc., to avoid false soldering and continuous soldering caused by the slant of the IC foot.
The manual placement machine is used in conjunction with the fully automatic SMT production line, which is of great significance for picking and placing special-shaped components and improving the production efficiency of the entire production line. Moreover, when used in conjunction with a fully automated SMT production line, it is a good alternative for small batch production or testing and when production is tight.
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