PCB (Printed Circuit Board) 3D printer manufacturer Nano Dimension has introduced a new feature based on the existing 3D printed printed circuit board technology, which enables electronics engineers to embed electronic components during circuit printing. Technology will improve PCB reliability, eliminate the need for soldering processes in PCB manufacturing, and create conditions for creating thinner PCBs.
The production of printed circuit boards is an extremely lengthy process. Every time a new engineer completes a new design, he or she needs to commission a third party to prototype the PCB, which increases the difficulty of controlling the new product development cycle. Nano Dimension's inkjet 3D printing technology enables rapid fabrication of multi-layer boards. The company has introduced the market's DragonFly2020 3D printer, using inkjet deposition and curing systems and self-developed AgCite nanoparticle conductive silver inks for hours. Multi-layer board printing can be done inside.
Nano Dimension's new features, in addition to enabling rapid prototyping of multilayer PCBs, can also embed electronic components directly into the circuit printing process, which provides the foundation for more complex electronic systems, said Nano Diemnsion This new feature will be integrated into future 3D printers.
Nano Dimension has summarized three advantages of this new feature. First, the ability to insert electronic components during circuit printing will protect them from exposure to external environments, thereby protecting their mechanical properties, temperature, and corrosion. The second advantage is that the embedded electronic components are interconnected by 3D printed conductive inks, so the soldering process can be avoided, which is beneficial to improve the quality and ease of use of printed circuit boards. The third advantage of the new feature is that direct printing with electronic components not fully packaged creates the conditions for creating ultra-thin PCBs.
Nano Dimension has used this new feature to 3D printed curved, bendable boards that can be applied to the Internet of Things. Nano Dimension has applied for US patents and trademarks for this new feature, and the technology will benefit users in the telecommunications, defense, consumer electronics and other fields.
(Editor)
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